鐢㈠搧鍚嶇ū : 鍗婂皫楂斿皝瑁濇脯瑭﹁ō鍌
鐢㈠搧浠嬬垂
鐒℃椤屾枃浠

D_I_logo
鎰涚櫦鎵浠g悊闊撳湅D.I鍏徃锛屽叾澶氬勾渚嗚嚧鍔涙柤闁嬬櫦瑷▓Burn-In娓│瑷倷锛孊urn-In Board鍙婄浉闂滅敘鍝侊紝 鍏朵綔鐢ㄥ湪鏂兼彁渚涗笉鍚岀挵澧冩韩搴﹀強娓│姊濅欢涓嬪彲鎻愭棭鐧肩従娓│鐢㈠搧鐨勪笉鑹紝浠ュ埄閫茶寰岀簩鐨勮檿鐞嗐

Package Burn-In & Tester
Test Burn-In Tester

Test Burn-In Tester绯诲垪瑷倷瑷▓鍙彁渚涘鎴舵渶浣崇殑Memory Burn-In 绋嬪簭瑙f焙鏂规锛屼笉鍍呮湁鑹杽鐨勮粺楂斿拰纭珨瑷▓锛岃屼笖閭勬湁閫蹭竴姝ュ崌绱氬姛鑳斤紝澶氬厓鍖栫殑閬告搰灏囧彲婊胯冻灏佽瀹屼箣瑷樻喍楂擨C寤f硾鐨凚urn-In娓│瑕佹眰锛岄欐ǎ澶氱ó椤炵殑鍨嬫厠鍙仼鍚堝悇绋洰鐨勶紝渚嬪閲忕敘锛屽搧璩椹楀拰鐮旂┒鐧煎睍锛屽皣鍙偤鎮ㄦ彁渚涙渶浣崇殑Burn-In娓│銆

Specifications

  • ~ 60鍊媠lots,60 BIB,4 Rack.
  • 涓鍊媧one(Temp./Control) ~ 澶氬媧one.
  • 婧害绡勫湇: -55鈩/QRA,-10鈩/AF8862 ~ 150鈩
  • 婧害Resolution: 0.1鈩
  • 鍙脯顿搁础惭,厂搁础惭,惭补蝉办搁翱惭,贵濒补蝉丑,惭颁笔..别迟肠.

Model

  • AF8852D6-For DRAM + MaskROM
  • AF8862C7-For DRAM + Flash
  • QRA SYSTEM-DM8827 / DM8857
D.I test
D.I test
Logic Burn-In Tester

Logic Burn-In Tester绯诲垪瑷倷瑷▓鍙彁渚涘鎴舵渶浣崇殑Logic Burn-In 绋嬪簭瑙f焙鏂规锛屽叾鑹杽鐨勮粺楂斿拰纭珨瑷▓锛屽彲鎻愪緵澶氬厓鍖栫殑閬告搰灏囧彲婊胯冻灏佽瀹屼箣閭忚集IC寤f硾鐨凚urn-In娓│瑕佹眰锛岄欐ǎ澶氱ó椤炵殑鍨嬫厠鍙仼鍚堝悇绋洰鐨勶紝渚嬪閲忕敘锛屽搧璩椹楀拰鐮旂┒鐧煎睍锛屽皣鍙偤鎮ㄦ彁渚涙渶浣崇殑 Burn-In 娓│銆

Specifications

  • ~ 32/48鍊媠lots,32/48 BIB,4 Rack .
  • Pattern zone : 4 ~ 32 (Option).
  • ITC, ALPG Function
  • Channel : 128 / 256 (Option).
  • 婧害绡勫湇:-40鈩/-10鈩 ~ +150鈩.
  • Vector Memory: 2M words(up to 4M).

Model

  • DL600 series
  • DL700
  • DL800
  • DL1100
D.I logic
D.I logic
Burn-In Board

BIB (Burn-In Board)鍏朵綔鐐哄崐灏庨珨IC鐢㈠搧杓夊叿,灏囨娓│涔婭C閫忛亷SOCKET鎴栨槸鍏朵粬鏂瑰紡鑸嘊IB閫g祼,鏀惧叆娓│姗熷彴鍏ч茶涓嶅悓婧害锛岄浕澹,淇¤櫉绛夌瓑涔嬫浠跺弽瑕嗘脯瑭︺

DRAM Burn-In Board

Specifications

  • Memory IC ( DRAM , SRAM , Flash ,MCP etc… ) .
  • Size of BIB : (290*630)+1mm / (450*570)+1mm .
  • BIB鏉愯唱:FR-4hi-ta,FR-5 or Polyamide .
  • Thickness : 1.6mm .
  • Pattern Layer : Multi(6Layers/8Layers) .
D.I dram
DLogic Burn-In Board

Specifications

  • Logic IC ( MCP , SOP , STACK IC etc… ) .
  • Size of BIB : (290*630)+1mm / (450*570)+1mm .
  • BIB鏉愯唱:FR-4hi-ta,FR-5 or Polyamide .
  • Pattern Layer : Multi(6Layers/8Layers/10/12Layers) .
D.I logic
A2112
Fully Auto UV Tape Curing System

Features

  • High intensity flash UV
  • No Nitrogen gas required
  • Single frame or cassette loading
  • High throughput
  • High quality and performance
  • Choice of UV Irradiation : 8” and 12” Wafer / Frame Curing
A2112 Fully Auto Specifications

Specifications

  • High speed Flash UV Irradiation curing on UV tape (5 -10 Sec Curing time)
  • No Nitrogen gas required
  • No cleaning gas filter required
  • Longer life span (Upto 80锛000 wafer cure per lamp)
  • No partial cure (100 % UV glue cure)
  • Tape remains stretchable after curing
  • Capable of UV irradiation for 8/12 inch wafer
  • Capable of UV iiradiation for 8/12 inch wafer ring frame

Utility Requirement

  • Power Supply : 220 -240 Vac锛孲ingle Phase
  • Ampere: 15 amp
  • Air Supply : 70 to 80 PSI
  • Machine Weight : 500kg Est
  • Dimension : 1070 (L) x 1080 (W) x 1150 (H) mm
鐩搁棞閫g祼